Thick diamond cutter processing methods are: mechanical grinding, grinding hot metal plate, ion beam, the laser beam and plasma etching.

Diamond sintered body tool

Processed into a thick film method using a diamond polishing damage rolling average particle size of the diamond grains 32 ~ 37μm or directly obtained using high-temperature high-pressure process diamond grains, the grain powder piled on the wc-16wt% co alloy, and then ta foil isolate sintered at 5.5gpa, 1500 ℃ for 60 minutes to prepare a diamond sintered body, the sintered body with the tools with high wear resistance.

Single-crystal diamond tool

Single-crystal diamond tool is usually fixed in the diamond crystal knife head, knife head with screws or plate fixed on the turning arbor. Diamond knife fixation in the head are: mechanical reinforcement method (bottom and diamond polished surface pressure, the pressure plate is fixed with a knife head); powder metallurgy method (the diamond on the alloy powder by adding pressure in the vacuum sintering, the diamond knife is fixed in the head); and the brazing bonding method (using an inorganic adhesive or other adhesive fixing diamond). Due to the thermal expansion coefficient of diamond and matrix differences between diamond and easy loose.