Thick welded diamond cutting tool production process generally include: preparation of a large area of diamond film; the film was cut diamond tools required shape and size; welding and cutting tool diamond thick substrate material; thick diamond cutting edge grinding and polishing .
Preparation and cutting diamond thick
Commonly used process for the preparation of diamond films cvd DC plasma jet method. The diamond deposition to wc + co alloy (mirror-finished surface) on the substrate in the cooling process, the diamond film off automatically. This method of depositing speed (up to 930μm / h), the binding between the lattice more closely, but the growth surface is rough. Diamond film of high hardness, wear resistance, non-conductive determines its cutting method is laser cutting (cutting can be performed in air, oxygen and argon environment). Not only can the use of laser-cut diamond thick cut to desired shape and size, you can cut out the rear corner of the tool, with a narrow kerf, efficiency and other advantages.
Welding thick diamond tool
Having between diamond and metals and their alloys in general high interfacial energy, resulting in a diamond can not be a general low-melting alloy infiltration, poor weldability. Mainly by adding strong carbide forming elements or by diamond surface metallization processing to improve between diamond and metal weldability in copper and silver alloy solder.