Thick welded diamond cutting tool production process generally include: preparation of large area diamond film; the film was cut into diamond shapes and sizes required tool; welding diamond thick substrate material and tool; diamond thick film cutting edge grinding and polishing .

Preparation and cutting diamond films

Commonly used process for the preparation of diamond films are dc plasma jet cvd law. The diamond deposition to wc + co alloy (mirror-finished surface) on the substrate during the cooling process, the diamond film off automatically. This method of deposition speed (up to 930μm / h), binding between the lattice more closely, but the rough growth surface. Diamond film with a high hardness, wear resistance, non-conductive determines its cutting method is laser cutting (cutting can be carried out in air, oxygen and argon environment). Laser cutting diamond films can not only cut to desired shape and size, but also can be cut out after the angle of the tool, with a narrow kerf, and high efficiency.