Having between diamond and metals and their alloys generally high interfacial energy, resulting in diamond can not be generally low melting point alloy infiltration, weldability is poor. At present, the addition of a strong carbide-forming elements or by diamond surface metallization process to improve the diamond and the metal between the solderability of copper and silver alloy solder.

Active brazing method

Copper silver alloy solder containing general ti and without soldering flux in an inert gas or vacuum. Commonly used solder composition ag = 68.8wt%, cu = 26.7wt%, ti = 4.5wt%, commonly used methods of preparation are arc melting and powder metallurgy. ti as an active element in the welding process and c reflect generation tic, can enhance wettability and adhesive strength of diamond and solder. The heating temperature is generally 850 ℃, incubated 10 minutes, slow cooling to reduce internal stress.

After soldering surface metallization

Metallized diamond surfaces by surface treatment technology of metal plating on the surface of the diamond, so that the surface having the properties of a metal or metalloid. Usually on the surface of the diamond plated ti, ti c reacts with tic, tic

And ag-cu alloy solder has good wetting and bonding strength. Titanium currently used methods are: vacuum physical vapor deposition (pvd, including vacuum evaporation deposition, vacuum sputtering, vacuum ion plating, etc.), chemical vapor plating and powder sintering coverage. pvd plating method single volume low, diamond plating process temperature below 500 ℃, the physical attachment between the coating and the diamond, chemical metallurgy. cvd law ti react chemically with the diamond form a strong metallurgical bond, the reaction temperature is high, damage diamond.