Commonly used process for the preparation of diamond films are dc plasma jet cvd law. The diamond deposition to wc + co alloy (mirror-finished surface) on the substrate during the cooling process, the diamond film off automatically. This method of deposition speed (up to 930μm / h), binding between the lattice more closely, but the rough growth surface. Diamond film with a high hardness, wear resistance, non-conductive determines its cutting method is laser cutting (cutting can be carried out in air, oxygen and argon environment). Laser cutting diamond films can not only cut to desired shape and size, but also can be cut out after the angle of the tool, with a narrow kerf, and high efficiency.
Diamond Thick Film Cutters Welding
Having between diamond and metals and their alloys generally high interfacial energy, resulting in diamond can not be generally low melting point alloy infiltration, weldability is poor. At present, the addition of a strong carbide-forming elements or by diamond surface metallization process to improve the diamond and the metal between the solderability of copper and silver alloy solder.
