In recent years, quite a number of precision grinding technology progress, especially for the manufacture of LSI large-diameter silicon substrate lapping technology has greatly improved. The silicon substrate surface quality requirements are very strict, not only requires a very small surface roughness, no scratches, good flatness, and requires no surface affected layer. Now our country has been able to produce 8-inch silicon substrate, we are developing and processing 10-inch silicon substrate, but are based on the introduction of foreign technology and the use of imported equipment. Urgent Need of independent research and development of 10 to 12-inch silicon substrate manufacturing technology and production equipment.