The CVD diamond thick film is a chemical vapor deposition diamond material. As a tool material its hardness is higher than PCD. Because it contains no metal binder, it has high thermal conductivity and high temperature oxidation resistance. However, the CVD material currently produced has relatively poor toughness, and it cannot be cut and processed by a wire cutting method, and its use has been limited. Due to the lack of cutting directionality, the grinding process is poor, making it extremely difficult to grind as sharp edges as natural diamond and synthetic single crystal diamond. The use as a cutting tool is still in the experimental stage, pending further research and development.